|
|
| Property of Industrial Diamond |
General properties of Diamond |
|
Property |
Value |
Units |
|
Hardness |
10,000 |
kg/mm2 |
|
Strength, tensile |
>1.2 |
Gpa |
|
Strength, compressive |
>110 |
Gpa |
|
Fracture strength |
400�800 |
MPa at < 1 mm thickness |
|
Sound velocity |
18,000 |
m/sec |
|
Density |
3.52 |
g/cm3 |
|
Young's modulus |
1200 |
GPa |
|
Poisson's ratio |
0.2 |
Dimensionless |
|
Atomic density |
1.77 x 1023 |
atoms/cm3 |
|
Thermal expansion coefficient |
1.1�5.0 (300-1300K) |
ppm/K |
|
Thermal conductivity |
10�20 |
W/cm-K |
|
Thermal shock parameter |
30,000,000 |
W/m |
|
Coefficient of friction |
0.05 (dry) |
Dimensionless |
|
Derbye temperature |
2,200 |
K |
|
Optical index of refraction (at (591 nm) |
2.41 |
Dimensionless |
|
Optical transmissivity range |
225 to far IR |
nm |
|
Emissivity |
0.02�0.03 |
at 10 microns |
|
Optical absorption coefficient |
0.05�0.3 |
at 10 microns |
|
Loss tangent at 40 Hz |
0.0006 |
Dimensionless |
|
Loss tangent at 140 GHz |
<10-5 |
Dimensionless |
|
Dielectric constant |
5.7 |
Dimensionless |
|
Dielectric strength |
10,000,000 |
V/cm |
|
Electron mobility |
2,200 |
cm2/V-sec |
|
Hole mobility |
1,600 |
cm2/V-sec |
|
Electron saturated velocity |
27,000,000 |
cm/sec |
|
Hole saturated velocity |
10,000,000 |
cm/sec |
|
Work function |
small and negative |
On [111] surface |
|
Bandgap |
5.45 |
eV |
|
Resistivity |
1013 - 1016 |
Ohm-cm | |
Thermal properties of Diamond and other electronic materials |
|
Material |
Thermal conductivity
W/cm/�K |
Thermal expansion coefficient
x 10-6/�K |
|
CVD diamond |
10�18 |
1.5 |
|
Silver |
4.1 |
19 |
|
Copper |
3.9 |
17 |
|
Beryllia |
2.5 |
6.4 |
|
CuW/90/10 |
1.7 |
6.5 |
|
Aluminum nitride |
1.7 |
4.6 |
|
Alumina |
0.25 |
8 |
|
Silicon |
1.5 |
4.1 |
|
GaAs |
0.44 |
6.5 | | |
